2 marks questions
1.Mention the advantages of interconnected circuits.
*Miniaturisation and hence increased equipment density.
*Cost reduction due to batch impact.
*Increased system reliability due to the settlement of soldered joints.
*Improved functional performance.
*Matched devices.
*Increased operating speeds.
*Reduction in power consumption.
2.Write down the various processes used to fabricate IC’s using silicon planar
technology.
*Silicon wafer preparation.
* Epitaxial growth
*Oxidation.
*Photolithography.
*Diffusion.
*Ion implantation.
*Isolation.
*Metallisation.
*Assembly processing and packaging.
3.What is the purpose of oxidation?
*SiO2 is an extremely hard protective coat and is unaffected by almost all
reagents.
*By selective etch of SiO2, diffusion of impurities through carefully defined
windows can be cultured to fabricate various components.
4.Why aluminium is preferred for metallization?
*It is a honourable conductor.
*it is easy to deposit aluminium films using vacuum deposition.
*It makes strong mechanical bonds with silicon.
*It forms a low resistance contact.
5. What are the hot IC packages available?
Metal can package.
Dual-in-line package.
Ceramic apartment package.
6.
Define an operational amplifier.
An operational amplifier is a direct-coupled, high fall upon amplifier consisting of
one or more differential amplifier. By by rights selecting the external components, it can
be used to perform a course of mathematical operations.
7.Mention the characteristics of an ideal op-amp.
* Open loop voltage defecate is infinity.
*Input impedance is infinity.
*Output impedance is zero.
*Bandwidth is infinity.
*Zero offset.
8.What happens when the parkland terminal of V+ and V- sources is not grounded?
If the common point of the cardinal supplies is not grounded, twice the supply voltage
will experience use and it may damage the op-amp.
9.Define input offset voltage.
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